Interfacial Delamination in Integrated Microsystems

Introduction Due to the goal of increasing functionality and decreasing costs in micro-electronic packages, integrated circuit processing and miniaturized fabrication technologies have been combined to result in microsystems such as System In Packages (SIP). Microsystems consist of multiple thin and stacked layers, manufactured using different materials. Hence, interfacial failures, mainly in the form of delamination, are probably the most prevalent issues in many future microsystems. The main focus of this research is to enrich an interfacial cohesive zone model so that the efficiency and robustness of the model is improved.